The PCB’s are fabricated by using modern small capacity technological processes installed in production laboratories of the department:
| CNC 3-spindle drilling machine |
| electroless/electrolytic plating line (with manual manipulation) |
| brushing and cleaning machines |
| dry photoresist hot roll laminator |
| solder mask vacuum laminator |
| permanganate desmear process |
| exposure unit |
| developing, etching and stripping lines |
| drying ovens |
| multilayer press |
| electrolytic gold plating equipment |
| lead-free HASL |
| PCB shape is finished by 1-spindle CNC routing machine or by optically controlled manually operated guillotine |