Activities of the PCB Development and Implementation Department
| The PCB’s are fabricated by using modern small capacity technological processes installed in production laboratories of the department: |
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CNC 3-spindle drilling machine |
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electroless/electrolytic plating line (with manual manipulation) |
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brushing and cleaning machines |
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dry photoresist hot roll laminator |
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solder mask vacuum laminator |
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permanganate desmear process |
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exposure unit |
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developing, etching and stripping lines |
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drying ovens |
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multilayer press |
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electrolytic gold plating equipment |
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lead-free HASL |
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PCB shape is finished by 1-spindle CNC routing machine or by optically controlled manually operated guillotine |
| Ecological safety is maintained by waste water neutralisation and disposal station. |
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| Basic Technical Parameters |
| Final PCB size: |
max. 400 x 400 mm |
| Standard thickness (up to 8-layer PCB): |
1,5 mm |
| Basic material: |
FR-4 |
| Cu thickness: |
18 or 35 um (option: 70, 9 or 5 um) |
| Drill diameter: |
min. 0,5 mm (optionally 0,3 mm) |
| Basic prices |
| Single sided PCB |
3.5 EUR/dm2 |
| Double sided PCB (line/space density to 0.3 mm) |
8.1 EUR/dm2 |
| 4-layer PCB |
14.3 EUR/dm2 |
| 6-layer PCB |
17.8 EUR/dm2 |
| 8-layer PCB |
22.0 EUR/dm2 |
| Optional technological processes (HAL, soldermask, gold plating, component screening, shaping by routing machine) are extra accounted.
Quantity discount: 10 % for more than 20 pcs. |
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| Contact Person |
| Head of production technology: Ing. Ivan Bešina, Phone: +421 2 5941 1113 |
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